900i Horizontal Batch-Sputtering System
The 900i Series features dual load lock, in-line, sputter down, batch systems configured with an optional high vacuum load lock and three or four target positions.
Overview
High-rate DC magnetron sputtering, single pass or multiple pass deposition and dual-level high vacuum pumped load lock features support the versatility and high-throughput of these production systems. Cathode and wafer orientation are horizontal, allowing the sputtered material to be transferred vertically.
Specifications
Vacuum Specifications
- Chamber ultimate ≤1 x 10-7 torr.
- Chamber leak rate, 20 minutes to 1 x 10-4 torr.
- High vacuum dome ultimate ≤1 x 10-7 torr.
- High vacuum dome leak rate, 15 minutes to 1 x 10-4 torr.
- Pump down from atmosphere 110 minutes or less to 1 x 10-6 torr or 2 x 10-7 torr overnight.
- Load-lock high vacuum pressures utilizing CTI-8 cryo pump.
Orientation
- Horizontal
Deposition Zone
- 13" x 13" pallet size
| SYSTEM CAPACITY | |||||||
|---|---|---|---|---|---|---|---|
| 900i PALLET 13" x 13" | 2" Wafers | 3" Wafers | 4" Wafers | 5" Wafers | 6" Wafers | 8" Wafers | 300mm |
| 36 | 16 | 9 | 5 | 4 | 1 | 1 | |
Series System Hardware Features
- 12kW low stored energy DC power supplies (Advanced Energy). Optional Pinnacle Plus power supplies.
- Integrated throttling SS VAT valve allowing for upstream or downstream pressure control.
- MKS multi component "Smart" 390 and 925 gauges for integrated vacuum measurements.
- Fully automated self locking top plate support system.
- Process gas control with up to four gas controllers; feedback controlled capacitance manometer; master/slave gas select ability; and gas ratio control.
- Stepper motor pallet carrier drive with optical encoder providing accurate programmable pallet carrier positioning, scan velocity profiling available.
- Low pressure hydraulics system for safety and smooth operation.
- Loadlock linear sensor - computer controller positioning system for increased loadlock accuracy and more limited fail-safe.
- 1.25kW/RF solid state power supply (Advanced Energy).
- Complies with NFPA79 guidelines.
- Consult factory for an extensive list of standard options.
- Optional Pallet Stacker replaces dual pallet shelf load-lock with 6 shelf hanger that allows for 5 pallet sequential operationShape.
Series Computer Sub-System
- Windows™ 10 based real-time GUI environment, coupled with 24" LCD touchscreen monitor mounted on an umbilicaled mobile HI cart.
- Context sensitive recipe manger running out of Microsoft® SQL database.
- Fully integrated package for real-time data display, data logging fully compatible with Excel™, Lotus™ and other Windows™ applications, report generation, remote interface and printing.
- Optional connectivity to SECS/GEM communication and Windows™ applications through and OPC server interface.
- Distributed Rockwell Control System utilizing Device Net and Ethernet IP field bus technologies.
- Maintenance test suite with full diagnostic and manual process control capability.
- Service friendly fully enclosed electronic cabinet.
Series Basic Facility Requirements
- Power: 208 VAC, 3-phase, 100 Amps
- Water: 6.5 GPM, 70 PSIG min., 10°C - 24°C
- Compressed Air: 85 - 100 PSIG
- Process Gas: 25 PSIG 99.999%
- Pure Gas: Dry N2
Production Targets Fitted for KDF Systems
We provide all configurations of targets and bonded assemblies for the 600, 700, 800 and 900 series KDF systems. As the system manufacturer, we are uniquely positioned to provide targets which perform at the highest level and meet the unique design requirements of the KDF sputtering systems.
Target materials will be provided in the correct configuration for the most demanding of applications - From R&D to high volume production.
Production techniques include:
- Vacuum induction melting
- Hot pressing
- Hot isostatic pressing
- Electron beam melting
- Sintering
All targets will be inspected, cleaned and package for use as received. Special inspection, labeling and packaging can implemented upon request. Products will undergo thorough quality checks of the dimensions, purity and other required specifications.
An SDS in the specified language and Certificate of Analysis will accompany each target. All products are responsibly sourced and Conflict Minerals free. DFARs and ITAR compliant products are available upon request.
Mu Configuration
- 4 Piece & Single Piece Designs
- 15", 17", 24" & 30" Lengths
- Common Materials: Ti, TiW, NiCr, NiV, Ta, Nb, Cr, Al, W, Mo, Ag, Ru - Others available upon request
Upsilon Configuration
- 4 Piece Design
- 15", 17" & 24" Lengths
- Common Materials: Au, Pt, Pd - Others available upon request
Chi Configuration
- 4 Piece & Single Piece Designs
- 15" & 17" Lengths
- Common Materials: Al, Al alloys, Cu
Standard Planar Configuration - Bonded Assembly
- Single or Multi-tile Design
- 15", 17" NTX & 24" Lengths
- Common Materials: Au, Pt, Al, Al alloys, Ti, TiW, Ni, Co, NiCr, NiV, Ta, Nb, Cr, W, Mo, Ag, Ru, Si - Others available upon request
3" X 17" Cathode
- Single or Multi-tile Design
- Common Materials: Au, Pt, Al, Al alloys, Ti, TiW, Ni, Co, NiCr, NiV, Ta, Nb, Cr, W, Mo, Ag, Ru, Si - Others available upon request